Semiconductor manufacturing handbook (Livro, 2005) [WorldCat.org]
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Semiconductor manufacturing handbook
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Semiconductor manufacturing handbook

Autor: Hwaiyu Geng
Editora: New York : McGraw-Hill, 2005
Séries: McGraw-Hill handbooks
Edição/Formato   Imprimir livro : InglêsVer todas as edições e formatos
Resumo:

Provides engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. This volume includes specific manufacturing reference data  Ler mais...

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Gênero/Forma: Handbooks and manuals
Handbooks, manuals, etc
Tipo de Documento Livro
Todos os Autores / Contribuintes: Hwaiyu Geng
ISBN: 0071445595 9780071445597
Número OCLC: 474613920
Descrição: 1 v. (various pagings) : illustrations
Conteúdos: PART 1: Semiconductor Fundamentals and Basic MaterialsBOARD OF REVIEWERSCONTRIBUTORSPREFACEACKNOWLEDGMENTSChapter 1: How Semiconductor Chips Are Made - Hwaiyu Geng, Lin ZhouChapter 2: IC Design - Ilsun ParkChapter 3: Silicon Substrates for Semiconductor Manufacturing - K.V. RaviChapter 4: Copper, Low-k Dielectrics, and Their Reliability - Hazara S. Rathore, Kaushik ChandaChapter 5: Fundamentals-Silicide Formation on Si - L.P. Ren, King N. TuChapter 6: Plasma Process Control - David J. CoumouChapter 7: Vacuum Technology - Peter BiltoftChapter 8: Photomask - Charles HowardPART 2: Wafer ProcessingChapter 9: Microlithography - Chris A. MackChapter 10: Ion Implantation and Rapid Thermal Processing - Michael GrafChapter 11: Wet Etching - Peng ZhangChapter 12: Plasma Etching - Shouliang LaiChapter 13: Physical Vapor Deposition - Florian SolzbacherChapter 14: Chemical Vapor Deposition - Edward J. McInerneyChapter 15: Epitaxy - Jamal Ramdani, Giovanni VaccariChapter 16: ECD Fundamentals - Tom Ritzdorf, John KlocksChapter 17: Chemical Mechanical Planarization - Timothy S. DyerChapter 18: Wet Cleaning - Andrew MachamerPart 3: Final ManufacturingChapter 19: Inspection, Measurement, and Test - Donald W. BlairChapter 20: Grinding, Stress Relief, and Dicing - Kazuhisa Arai, Yoshikazu Kobayashi, Hideaki OtaniChapter 21: Packaging - Dietrich Tonnies, Michael TopperPart 4: Nanotechnology, MEMS, and FPDChapter 22: Nanotechnology and Nanomanufacturing - Zhong L. WangChapter 23: Fundamentals of Microelectromechanical Systems - Michael A. HuffChapter 24: Flat-Panel Display Technology and Manufacturing - David N. LiuPart 5: Gases and ChemicalsChapter 25: Specialty Gas and CDA Systems - Wayne D. CurcieChapter 26: Waste Gas Abatement Systems - Joseph D. SweeneyChapter 27: PFC Abatement - James C. CoxChapter 28: Chemical and Slurry Handling Systems - Kristin Cavicchi, Dan BarsnessChapter 29: Fluid Handling Components for High Purity Liquid Chemicals and Slurries - Charles K. GouldChapter 30: Fundamentals of Ultrapure Water - David J. AlbrechtPart 6: Fab Yield, Operations, and FacilitiesChapter 31: Yield Management - Bo Li, Wayne CarrikerChapter 32: Automated Material Handling System - Clint HarrisChapter 33: CD Metrology and CD-SEM - Ram Peltinov, Mina MenakerChapter 34: Six Sigma - Bruno Scibilia, Yoan DupretChapter 35: Advanced Process Control - Robert H. McCaffertyChapter 36: Environmental, Health, and Safety (EHS) Considerations in Semiconductor Fabrication Facilities - Brett J. Davis, Steven R. TrammellChapter 37: Plan, Design, and Construction of a FAB - Industrial Design and ConstructionChapter 38: Cleanroom Design and Construction - Richard V. Pavlotsky, Stephen C. BeckChapter 39: Micro-Vibration and Noise Design - Michael Gandreau, Hal AmickChapter 40: ESD Controls in Cleanroom Environments - Larry LevitChapter 41: Airborne Molecular Contamination - Chris MullerChapter 42: Particle Monitoring in Semiconductor Manufacturing - Steven Kochevar, Jerry GromalaChapter 43: Wastewater Neutralization Systems - Richard E. PinkowskiAPPENDIXINDEX
Título da Série: McGraw-Hill handbooks
Responsabilidade: Hwaiyu Geng, editor in chief

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