Semiconductor manufacturing handbook (eBook, 2017) [WorldCat.org]
skip to content
Semiconductor manufacturing handbook Preview this item
ClosePreview this item
Checking...

Semiconductor manufacturing handbook

Author: Hwaiyu Geng
Publisher: New York, N.Y. : McGraw-Hill Education, [2017] ©2017
Edition/Format:   eBook : Document : English : 2nd editionView all editions and formats
Summary:
Thoroughly revised, state-of-the-art semiconductor design, manufacturing, and operations information. Written by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of IC chips, MEMS, sensors, and other electronic devices.
Rating:

(not yet rated) 0 with reviews - Be the first.

Subjects
More like this

Find a copy online

Links to this item

Find a copy in the library

&AllPage.SpinnerRetrieving; Finding libraries that hold this item...

Details

Genre/Form: Handbooks and manuals
Electronic books
Handbooks, manuals, etc
Additional Physical Format: Print version:
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Hwaiyu Geng
ISBN: 9781259583124 1259583120
OCLC Number: 1016054932
Language Note: In English.
Description: 1 online resource (704 pages) : 400 illustrations.
Contents: Cover --
Title Page --
Copyright Page --
Dedication --
About the Editor --
Contents in Brief --
Contents --
Technical Advisory Board --
Contributors --
Foreword --
Preface --
Acknowledgments --
Part 1 Semiconductor Manufacturing Fundamentals --
Chapter 1. Semiconductor Manufacturing, the Internet of Things, and Sustainability --
Chapter 2. Nanotechnology and Nanomanufacturing: From Silicon to New Carbon-Based Materials and Beyond --
Chapter 3. Fundamentals of FinFET and Recent Advances in Nanoscale Silicide Formation --
Chapter 4. Foundations of Microsystems Manufacturing: An Empowering Technology for the IoT --
Chapter 5. Physical Design for High-Performance, Low-Power, and Reliable 3D Integrated Circuits --
Part 2 Front-End-of-Line Processes --
Chapter 6. Epitaxy Jamal Ramdani --
Chapter 7. Thermal Processing: Anneals, RTP, and Oxidation --
Chapter 8. Microlithography --
Chapter 9. Etching --
Chapter 10. Ion Implantation --
Chapter 11. Introduction to Physical Vapor Deposition --
Chapter 12. Chemical Vapor Deposition --
Chapter 13. Atomic Layer Deposition --
Chapter 14. Electrochemical Deposition --
Chapter 15. Fundamentals of Chemical Mechanical Planarization --
Chapter 16. AFM Metrology --
Part 3 Back-End-of-Line Processes --
Chapter 17. Wafer Thinning and Singulation --
Chapter 18. Packaging --
Chapter 19. Bonding Fundamentals --
Chapter 20. Interconnects Reliability --
Chapter 21. Automatic Test Equipment --
Part 4 Technologies for Flexible Hybrid Electronics and Large-Area Electronics --
Chapter 22. Printed Electronics: Principles, Materials, Processes, and Applications --
Chapter 23. Flexible Hybrid Electronics --
Chapter 24. Flexible Electronics --
Chapter 25. RF Printed Electronics: Communication, Sensing, and Energy Harvesting for the Internet of Things and Smart Skin Applications --
Chapter 26. Printing of Nanoscale Electronics and Power Electronics --
Chapter 27. 3D Interconnects in Flexible Electronics --
Chapter 28. Materials for the Manufacturing of an Inkjet Printed Touch Sensor --
Chapter 29. Flat-Panel and Flexible Display Technology --
Chapter 30. Photovoltaics Fundamentals, Manufacturing, Installation, and Operations --
Part 5 Process Gases and Chemicals --
Chapter 31. Gas Distribution Systems --
Chapter 32. Fundamentals of Ultrapure Water --
Chapter 33. Process Chemicals, Handling, and Abatement --
Chapter 34. Filtration --
Chapter 35. Chemical and Slurry Handling Systems --
Part 6 Operations, Equipment, and Facilities --
Chapter 36. Yield Management --
Chapter 37. CIM and Factory Automation --
Chapter 38. MES Fundamentals --
Chapter 39. Advanced Process Control --
Chapter 40. Airborne Molecular Contamination --
Chapter 41. ESD Controls in Cleanroom Environments --
Chapter 42. Vacuum Systems --
Chapter 43. Control of RF Plasma Processing --
Chapter 44. IC Manufacturing Equipment Parts Cleaning Technology: Fundamentals and Applications --
Chapter 45. Equipment Design Challenges due to Increasing Hazards and Regulations --
Chapter 46. Cleanroom Design and Construction --
Chapter 47. Vibration and Noise Design --
Index --
A --
B --
C --
D --
E --
F --
G --
H --
I --
J --
K --
L --
M --
N --
O --
P --
Q --
R --
S --
T --
U --
V --
W --
X --
Y --
Z.
Responsibility: Hwaiyu Geng.

Abstract:

Fully updated, state-of-the-art semiconductor design and manufacturing information  Read more...

Reviews

User-contributed reviews
Retrieving GoodReads reviews...
Retrieving DOGObooks reviews...

Tags

Be the first.
Confirm this request

You may have already requested this item. Please select Ok if you would like to proceed with this request anyway.

Close Window

Please sign in to WorldCat 

Don't have an account? You can easily create a free account.