Semiconductor manufacturing handbook (e-Boek, 2017) [WorldCat.org]
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Semiconductor manufacturing handbook

Auteur: Hwaiyu Geng
Uitgever: New York, N.Y. : McGraw-Hill Education, [2017] ©2017
Editie/materiaalsoort:   eBoek : Document : Engels : 2nd editionAlle edities en materiaalsoorten bekijken.
Samenvatting:
Thoroughly revised, state-of-the-art semiconductor design, manufacturing, and operations information. Written by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of IC chips, MEMS, sensors, and other electronic devices.
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Gegevens

Genre/vorm: Handbooks and manuals
Electronic books
Handbooks, manuals, etc
Aanvullende fysieke materiaalsoort: Print version:
Materiaalsoort: Document, Internetbron
Soort document: Internetbron, Computerbestand
Alle auteurs / bijdragers: Hwaiyu Geng
ISBN: 9781259583124 1259583120
OCLC-nummer: 1016054932
Opmerking taal: In English.
Beschrijving: 1 online resource (704 pages) : 400 illustrations.
Inhoud: Cover --
Title Page --
Copyright Page --
Dedication --
About the Editor --
Contents in Brief --
Contents --
Technical Advisory Board --
Contributors --
Foreword --
Preface --
Acknowledgments --
Part 1 Semiconductor Manufacturing Fundamentals --
Chapter 1. Semiconductor Manufacturing, the Internet of Things, and Sustainability --
Chapter 2. Nanotechnology and Nanomanufacturing: From Silicon to New Carbon-Based Materials and Beyond --
Chapter 3. Fundamentals of FinFET and Recent Advances in Nanoscale Silicide Formation --
Chapter 4. Foundations of Microsystems Manufacturing: An Empowering Technology for the IoT --
Chapter 5. Physical Design for High-Performance, Low-Power, and Reliable 3D Integrated Circuits --
Part 2 Front-End-of-Line Processes --
Chapter 6. Epitaxy Jamal Ramdani --
Chapter 7. Thermal Processing: Anneals, RTP, and Oxidation --
Chapter 8. Microlithography --
Chapter 9. Etching --
Chapter 10. Ion Implantation --
Chapter 11. Introduction to Physical Vapor Deposition --
Chapter 12. Chemical Vapor Deposition --
Chapter 13. Atomic Layer Deposition --
Chapter 14. Electrochemical Deposition --
Chapter 15. Fundamentals of Chemical Mechanical Planarization --
Chapter 16. AFM Metrology --
Part 3 Back-End-of-Line Processes --
Chapter 17. Wafer Thinning and Singulation --
Chapter 18. Packaging --
Chapter 19. Bonding Fundamentals --
Chapter 20. Interconnects Reliability --
Chapter 21. Automatic Test Equipment --
Part 4 Technologies for Flexible Hybrid Electronics and Large-Area Electronics --
Chapter 22. Printed Electronics: Principles, Materials, Processes, and Applications --
Chapter 23. Flexible Hybrid Electronics --
Chapter 24. Flexible Electronics --
Chapter 25. RF Printed Electronics: Communication, Sensing, and Energy Harvesting for the Internet of Things and Smart Skin Applications --
Chapter 26. Printing of Nanoscale Electronics and Power Electronics --
Chapter 27. 3D Interconnects in Flexible Electronics --
Chapter 28. Materials for the Manufacturing of an Inkjet Printed Touch Sensor --
Chapter 29. Flat-Panel and Flexible Display Technology --
Chapter 30. Photovoltaics Fundamentals, Manufacturing, Installation, and Operations --
Part 5 Process Gases and Chemicals --
Chapter 31. Gas Distribution Systems --
Chapter 32. Fundamentals of Ultrapure Water --
Chapter 33. Process Chemicals, Handling, and Abatement --
Chapter 34. Filtration --
Chapter 35. Chemical and Slurry Handling Systems --
Part 6 Operations, Equipment, and Facilities --
Chapter 36. Yield Management --
Chapter 37. CIM and Factory Automation --
Chapter 38. MES Fundamentals --
Chapter 39. Advanced Process Control --
Chapter 40. Airborne Molecular Contamination --
Chapter 41. ESD Controls in Cleanroom Environments --
Chapter 42. Vacuum Systems --
Chapter 43. Control of RF Plasma Processing --
Chapter 44. IC Manufacturing Equipment Parts Cleaning Technology: Fundamentals and Applications --
Chapter 45. Equipment Design Challenges due to Increasing Hazards and Regulations --
Chapter 46. Cleanroom Design and Construction --
Chapter 47. Vibration and Noise Design --
Index --
A --
B --
C --
D --
E --
F --
G --
H --
I --
J --
K --
L --
M --
N --
O --
P --
Q --
R --
S --
T --
U --
V --
W --
X --
Y --
Z.
Verantwoordelijkheid: Hwaiyu Geng.

Samenvatting:

Fully updated, state-of-the-art semiconductor design and manufacturing information  Meer lezen...

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