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Genre/Form: | Handbook Handbooks and manuals Guides et manuels Handbooks, manuals, etc Guides, manuels, etc |
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Additional Physical Format: | Print version: Semiconductor manufacturing handbook. New York : McGraw-Hill Education, [2018] (DLC) 2017951483 (OCoLC)1005097007 |
Material Type: | Document, Internet resource |
Document Type: | Internet Resource, Computer File |
All Authors / Contributors: |
Hwaiyu Geng |
ISBN: | 9781259583124 1259583120 |
OCLC Number: | 1014184427 |
Description: | 1 online resource : illustrations |
Contents: | Part 1 Semiconductor Manufacturing Fundamentals -- Chapter 1. Semiconductor Manufacturing, the Internet of Things, and Sustainability -- Chapter 2. Nanotechnology and Nanomanufacturing: From Silicon to New Carbon-Based Materials and Beyond -- Chapter 3. Fundamentals of FinFET and Recent Advances in Nanoscale Silicide Formation -- Chapter 4. Foundations of Microsystems Manufacturing: An Empowering Technology for the IoT -- Chapter 5. Physical Design for High-Performance, Low-Power, and Reliable 3D Integrated Circuits -- Part 2 Front-End-of-Line Processes -- Chapter 6. Epitaxy Jamal Ramdani -- Chapter 7. Thermal Processing: Anneals, RTP, and Oxidation -- Chapter 8. Microlithography -- Chapter 9. Etching -- Chapter 10. Ion Implantation -- Chapter 11. Introduction to Physical Vapor Deposition -- Chapter 12. Chemical Vapor Deposition -- Chapter 13. Atomic Layer Deposition -- Chapter 14. Electrochemical Deposition -- Chapter 15. Fundamentals of Chemical Mechanical Planarization -- Chapter 16. AFM Metrology -- Part 3 Back-End-of-Line Processes -- Chapter 17. Wafer Thinning and Singulation -- Chapter 18. Packaging -- Chapter 19. Bonding Fundamentals -- Chapter 20. Interconnects Reliability -- Chapter 21. Automatic Test Equipment -- Part 4 Technologies for Flexible Hybrid Electronics and Large-Area Electronics -- Chapter 22. Printed Electronics: Principles, Materials, Processes, and Applications -- Chapter 23. Flexible Hybrid Electronics -- Chapter 24. Flexible Electronics -- Chapter 25. RF Printed Electronics: Communication, Sensing, and Energy Harvesting for the Internet of Things and Smart Skin Applications -- Chapter 26. Printing of Nanoscale Electronics and Power Electronics -- Chapter 27. 3D Interconnects in Flexible Electronics -- Chapter 28. Materials for the Manufacturing of an Inkjet Printed Touch Sensor -- Chapter 29. Flat-Panel and Flexible Display Technology -- Chapter 30. Photovoltaics Fundamentals, Manufacturing, Installation, and Operations -- Part 5 Process Gases and Chemicals -- Chapter 31. Gas Distribution Systems -- Chapter 32. Fundamentals of Ultrapure Water -- Chapter 33. Process Chemicals, Handling, and Abatement -- Chapter 34. Filtration -- Chapter 35. Chemical and Slurry Handling Systems -- Part 6 Operations, Equipment, and Facilities -- Chapter 36. Yield Management -- Chapter 37. CIM and Factory Automation -- Chapter 38. MES Fundamentals -- Chapter 39. Advanced Process Control -- Chapter 40. Airborne Molecular Contamination -- Chapter 41. ESD Controls in Cleanroom Environments -- Chapter 42. Vacuum Systems -- Chapter 43. Control of RF Plasma Processing -- Chapter 44. IC Manufacturing Equipment Parts Cleaning Technology: Fundamentals and Applications -- Chapter 45. Equipment Design Challenges due to Increasing Hazards and Regulations -- Chapter 46. Cleanroom Design and Construction -- Chapter 47. Vibration and Noise Design |
Responsibility: | Hwaiyu Geng [editor] |
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