Semiconductor manufacturing handbook (电子图书, 2018) [WorldCat.org]
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Semiconductor manufacturing handbook

著者: Hwaiyu Geng
出版商: New York : McGraw-Hill Education, [2018] ©2018
版本/格式:   电子图书 : 文献 : 英语 : Second edition查看所有的版本和格式
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类型/形式: Handbooks and manuals
Handbooks, manuals, etc
附加的形体格式: Print version:
Semiconductor manufacturing handbook.
New York : McGraw-Hill Education, [2018]
(DLC) 2017951483
(OCoLC)1005097007
材料类型: 文献, 互联网资源
文档类型 互联网资源, 计算机文档
所有的著者/提供者: Hwaiyu Geng
ISBN: 9781259583124 1259583120
OCLC号码: 1014184427
描述: 1 online resource : illustrations
内容: Part 1 Semiconductor Manufacturing Fundamentals --
Chapter 1. Semiconductor Manufacturing, the Internet of Things, and Sustainability --
Chapter 2. Nanotechnology and Nanomanufacturing: From Silicon to New Carbon-Based Materials and Beyond --
Chapter 3. Fundamentals of FinFET and Recent Advances in Nanoscale Silicide Formation --
Chapter 4. Foundations of Microsystems Manufacturing: An Empowering Technology for the IoT --
Chapter 5. Physical Design for High-Performance, Low-Power, and Reliable 3D Integrated Circuits --
Part 2 Front-End-of-Line Processes --
Chapter 6. Epitaxy Jamal Ramdani --
Chapter 7. Thermal Processing: Anneals, RTP, and Oxidation --
Chapter 8. Microlithography --
Chapter 9. Etching --
Chapter 10. Ion Implantation --
Chapter 11. Introduction to Physical Vapor Deposition --
Chapter 12. Chemical Vapor Deposition --
Chapter 13. Atomic Layer Deposition --
Chapter 14. Electrochemical Deposition --
Chapter 15. Fundamentals of Chemical Mechanical Planarization --
Chapter 16. AFM Metrology --
Part 3 Back-End-of-Line Processes --
Chapter 17. Wafer Thinning and Singulation --
Chapter 18. Packaging --
Chapter 19. Bonding Fundamentals --
Chapter 20. Interconnects Reliability --
Chapter 21. Automatic Test Equipment --
Part 4 Technologies for Flexible Hybrid Electronics and Large-Area Electronics --
Chapter 22. Printed Electronics: Principles, Materials, Processes, and Applications --
Chapter 23. Flexible Hybrid Electronics --
Chapter 24. Flexible Electronics --
Chapter 25. RF Printed Electronics: Communication, Sensing, and Energy Harvesting for the Internet of Things and Smart Skin Applications --
Chapter 26. Printing of Nanoscale Electronics and Power Electronics --
Chapter 27. 3D Interconnects in Flexible Electronics --
Chapter 28. Materials for the Manufacturing of an Inkjet Printed Touch Sensor --
Chapter 29. Flat-Panel and Flexible Display Technology --
Chapter 30. Photovoltaics Fundamentals, Manufacturing, Installation, and Operations --
Part 5 Process Gases and Chemicals --
Chapter 31. Gas Distribution Systems --
Chapter 32. Fundamentals of Ultrapure Water --
Chapter 33. Process Chemicals, Handling, and Abatement --
Chapter 34. Filtration --
Chapter 35. Chemical and Slurry Handling Systems --
Part 6 Operations, Equipment, and Facilities --
Chapter 36. Yield Management --
Chapter 37. CIM and Factory Automation --
Chapter 38. MES Fundamentals --
Chapter 39. Advanced Process Control --
Chapter 40. Airborne Molecular Contamination --
Chapter 41. ESD Controls in Cleanroom Environments --
Chapter 42. Vacuum Systems --
Chapter 43. Control of RF Plasma Processing --
Chapter 44. IC Manufacturing Equipment Parts Cleaning Technology: Fundamentals and Applications --
Chapter 45. Equipment Design Challenges due to Increasing Hazards and Regulations --
Chapter 46. Cleanroom Design and Construction --
Chapter 47. Vibration and Noise Design
责任: Hwaiyu Geng [editor]

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