Semiconductor manufacturing handbook (전자도서, 2018) [WorldCat.org]
컨텐츠로 이동
Semiconductor manufacturing handbook 해당 항목을 미리보기
닫기해당 항목을 미리보기
해당 아이템을 전자로 보기 위한 자원 선택하기

Semiconductor manufacturing handbook

저자: Hwaiyu Geng
출판사: New York : McGraw-Hill Education, [2018] ©2018
판/형식:   전자도서 : 문서 : 영어 : Second edition모든 판과 형식 보기
평가:

(아무런 평가가 없습니다.) 0 리뷰와 함께 - 첫번째로 올려주세요.

주제
다음과 같습니다:

온라인으로 문서 찾기

이 항목에 대한 링크

도서관에서 사본 찾기

&AllPage.SpinnerRetrieving; 해당항목을 보유하고 있는 도서관을 찾는 중

상세정보

장르/형태: Handbooks and manuals
Handbooks, manuals, etc
추가적인 물리적 형식: Print version:
Semiconductor manufacturing handbook.
New York : McGraw-Hill Education, [2018]
(DLC) 2017951483
(OCoLC)1005097007
자료 유형: 문서, 인터넷 자료
문서 유형 인터넷 자원, 컴퓨터 파일
모든 저자 / 참여자: Hwaiyu Geng
ISBN: 9781259583124 1259583120
OCLC 번호: 1014184427
설명: 1 online resource : illustrations
내용: Part 1 Semiconductor Manufacturing Fundamentals --
Chapter 1. Semiconductor Manufacturing, the Internet of Things, and Sustainability --
Chapter 2. Nanotechnology and Nanomanufacturing: From Silicon to New Carbon-Based Materials and Beyond --
Chapter 3. Fundamentals of FinFET and Recent Advances in Nanoscale Silicide Formation --
Chapter 4. Foundations of Microsystems Manufacturing: An Empowering Technology for the IoT --
Chapter 5. Physical Design for High-Performance, Low-Power, and Reliable 3D Integrated Circuits --
Part 2 Front-End-of-Line Processes --
Chapter 6. Epitaxy Jamal Ramdani --
Chapter 7. Thermal Processing: Anneals, RTP, and Oxidation --
Chapter 8. Microlithography --
Chapter 9. Etching --
Chapter 10. Ion Implantation --
Chapter 11. Introduction to Physical Vapor Deposition --
Chapter 12. Chemical Vapor Deposition --
Chapter 13. Atomic Layer Deposition --
Chapter 14. Electrochemical Deposition --
Chapter 15. Fundamentals of Chemical Mechanical Planarization --
Chapter 16. AFM Metrology --
Part 3 Back-End-of-Line Processes --
Chapter 17. Wafer Thinning and Singulation --
Chapter 18. Packaging --
Chapter 19. Bonding Fundamentals --
Chapter 20. Interconnects Reliability --
Chapter 21. Automatic Test Equipment --
Part 4 Technologies for Flexible Hybrid Electronics and Large-Area Electronics --
Chapter 22. Printed Electronics: Principles, Materials, Processes, and Applications --
Chapter 23. Flexible Hybrid Electronics --
Chapter 24. Flexible Electronics --
Chapter 25. RF Printed Electronics: Communication, Sensing, and Energy Harvesting for the Internet of Things and Smart Skin Applications --
Chapter 26. Printing of Nanoscale Electronics and Power Electronics --
Chapter 27. 3D Interconnects in Flexible Electronics --
Chapter 28. Materials for the Manufacturing of an Inkjet Printed Touch Sensor --
Chapter 29. Flat-Panel and Flexible Display Technology --
Chapter 30. Photovoltaics Fundamentals, Manufacturing, Installation, and Operations --
Part 5 Process Gases and Chemicals --
Chapter 31. Gas Distribution Systems --
Chapter 32. Fundamentals of Ultrapure Water --
Chapter 33. Process Chemicals, Handling, and Abatement --
Chapter 34. Filtration --
Chapter 35. Chemical and Slurry Handling Systems --
Part 6 Operations, Equipment, and Facilities --
Chapter 36. Yield Management --
Chapter 37. CIM and Factory Automation --
Chapter 38. MES Fundamentals --
Chapter 39. Advanced Process Control --
Chapter 40. Airborne Molecular Contamination --
Chapter 41. ESD Controls in Cleanroom Environments --
Chapter 42. Vacuum Systems --
Chapter 43. Control of RF Plasma Processing --
Chapter 44. IC Manufacturing Equipment Parts Cleaning Technology: Fundamentals and Applications --
Chapter 45. Equipment Design Challenges due to Increasing Hazards and Regulations --
Chapter 46. Cleanroom Design and Construction --
Chapter 47. Vibration and Noise Design
책임: Hwaiyu Geng [editor]

리뷰

사용자-기여 리뷰
GoodReads 리뷰 가져오는 중…
DOGObooks 리뷰를 가지고 오는 중…

태그

첫번째 되기

유사 항목

요청하신 것을 확인하기

이 항목을 이미 요청하셨을 수도 있습니다. 만약 이 요청을 계속해서 진행하시려면 Ok을 선택하세요.

윈도우 닫기

WorldCat에 로그인 하십시오 

계정이 없으세요? 아주 간단한 절차를 통하여 무료 계정을 만드실 수 있습니다.